{"id":2434,"date":"2025-11-21T11:27:19","date_gmt":"2025-11-21T11:27:19","guid":{"rendered":"https:\/\/wp-productionenv-bjg9h2g2bgg5b8aa.southeastasia-01.azurewebsites.net\/news\/globalfoundries-and-bae-systems-partners-to-power-next-generation-space-ready-chips\/"},"modified":"2025-11-21T11:27:19","modified_gmt":"2025-11-21T11:27:19","slug":"globalfoundries-and-bae-systems-partners-to-power-next-generation-space-ready-chips","status":"publish","type":"post","link":"https:\/\/starpath.global\/news\/globalfoundries-and-bae-systems-partners-to-power-next-generation-space-ready-chips\/","title":{"rendered":"GlobalFoundries and BAE Systems Partners to Power Next-Generation Space-Ready Chips"},"content":{"rendered":"

\"GlobalFoundries<\/p>\n

GlobalFoundries announced that BAE Systems will use GF\u2019s advanced FinFET semiconductor technology in a new offering for space applications. Securely manufactured at GF\u2019s facility in Malta, New York, this technology enables BAE Systems and others to create highly differentiated chips for electronic systems to withstand the harsh environment of space.<\/p>\n

With its new RH12\u2122 Storefront, BAE Systems, using its intellectual property and design techniques, has created a turnkey solution to allow for the rapid development of custom radiation-hardened semiconductor solutions for space applications. These chips are manufactured using GF\u2019s high-volume commercial 12LP FinFET technology platform that delivers excellent processing performance, secure connectivity, exceptional power efficiency, and reliability for demanding applications such as space avionics and telecommunications. With integrated features for RF, low-power memory, and logic, the 12LP platform enables customizable, compact designs for increasingly complex technologies that handle processing and connectivity.<\/p>\n

\u201cOur work with BAE Systems is a tremendous example of the value<\/em> GF<\/em> can create using our feature-rich commercial semiconductor platforms to create new, highly differentiated chips for use in sensitive aerospace and defense systems,\u201d said <\/strong><\/em>Ezra Hall<\/strong><\/em>, senior director of aerospace, defense, and critical infrastructure at GF. <\/strong>\u201cGF\u2019s essential chips deliver the performance, reliability, and yield of our commercial offerings but with custom enhancements for aerospace and defense applications and security features, enabled through our DMEA accreditation.\u201d<\/em><\/p>\n

\n

Also Read: BAE Systems \u2013 Engineering Integrated Space and Mission Solutions for Exploration, Defense and Discovery<\/h4>\n<\/div>\n

\u201cOur <\/em>RH12 Storefront <\/em>provides a turnkey solution for customers requiring radiation-hardened 12-nanometer integrated circuits,\u201d said <\/strong><\/em>Joe Dziezynski<\/strong><\/em>, director of Space Systems at BAE Systems.<\/strong> \u201cThis approach uses commercial foundry technology for space missions, qualifying not only the library components but also the process for how each of those components is designed into customer-integrated circuits. Customers now have a one-stop shop for state-of-the-art microelectronics performance to complete their missions in the harsh space environment.\u201d<\/em><\/p>\n

BAE Systems applies radiation-hardening design techniques to enable chips to be used in space. GF is a longstanding supplier to BAE Systems and supplies chips built on its 12S0 SOI technology. The new offering on GF\u2019s FinFET platform enables a new generation of reliable, high-performance, and energy-efficient chips for space-based computing.<\/p>\n

GF\u2019s Malta, New York facility is accredited to securely and reliably manufacture sensitive chips for BAE Systems and other aerospace and defense customers, meeting strict standards for manufacturing semiconductors used in critical land, air, sea, and space systems. Additionally, GF complies with ITAR and EAR export controls, reinforced by GF\u2019s industry-leading GF Shield security platform.<\/p>\n","protected":false},"excerpt":{"rendered":"

GlobalFoundries announced that BAE Systems will use GF\u2019s advanced FinFET semiconductor technology in a new offering for space applications. Securely manufactured at GF\u2019s facility in Malta, New York, this technology enables BAE Systems and others to create highly differentiated chips for electronic systems to withstand the harsh environment of space. With its new RH12\u2122 Storefront, […]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"inline_featured_image":false,"footnotes":"","_links_to":"","_links_to_target":""},"categories":[2],"tags":[39,41,26,96],"class_list":["post-2434","post","type-post","status-publish","format-standard","hentry","category-news","tag-aerospace","tag-defense","tag-ground","tag-memory"],"acf":[],"_links":{"self":[{"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/posts\/2434"}],"collection":[{"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/comments?post=2434"}],"version-history":[{"count":0,"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/posts\/2434\/revisions"}],"wp:attachment":[{"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/media?parent=2434"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/categories?post=2434"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/tags?post=2434"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}