{"id":79955,"date":"2013-09-25T19:36:34","date_gmt":"2013-09-25T11:36:34","guid":{"rendered":"https:\/\/wp-productionenv-bjg9h2g2bgg5b8aa.southeastasia-01.azurewebsites.net\/news\/macom-releases-highly-integrated-plastic-packaged-control-mmic-for-commercial-radar-applications\/"},"modified":"2013-09-25T19:36:34","modified_gmt":"2013-09-25T11:36:34","slug":"macom-releases-highly-integrated-plastic-packaged-control-mmic-for-commercial-radar-applications","status":"publish","type":"post","link":"https:\/\/starpath.global\/news\/macom-releases-highly-integrated-plastic-packaged-control-mmic-for-commercial-radar-applications\/","title":{"rendered":"Macom Releases Highly Integrated Plastic Packaged Control MMIC for Commercial Radar Applications"},"content":{"rendered":"<\/p>\n<p>[Via Satellite 09-25-13] <b>Macom Technology Solutions (Macom)<\/b> has released its new X-Band Core Chip (MAMF-011015), product of a joint investment between Macom and <b>FIRST RF Corporation<\/b>. The integrated core chip for the 8 GHz to 11 GHz frequency range, is a highly integrated solution setting new standards for size, weight, and performance (SWaP) enabling the next generation of radar system design.<\/p>\n<p>The X-Band Core Chip integrates a Complementary metal-oxide-semiconductor (CMOS) logic driver with a GaAs Transmit\/Receive Monolithic Microwave Integrated Circuit (MMIC) within a single quad-flat no-leads package. The surface mount 7x7mm plastic package offers a cost-effective, easy to implement solution.<\/p>\n<p>The packaged device comprises of a common leg circuit, which includes digital attenuators, phase shifters, a low noise receive chain, and a transmit driver amplifier, as well as a CMOS logic driver. This integrated circuit uses MACOM\u2019s advanced 0.25um PHEMT process, which has been optimized for high power and low noise amplifiers, passive and control components and allows for a high level of integration on a single MMIC.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>[Via Satellite 09-25-13] Macom Technology Solutions (Macom) has released its new X-Band Core Chip (MAMF-011015), product of a joint investment between Macom and FIRST RF Corporation. The integrated core chip for the 8 GHz to 11 GHz frequency range, is a highly integrated solution setting new standards for size, weight, and performance (SWaP) enabling the [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":79957,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"inline_featured_image":false,"footnotes":"","_links_to":"","_links_to_target":""},"categories":[2],"tags":[],"class_list":["post-79955","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news"],"acf":[],"_links":{"self":[{"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/posts\/79955"}],"collection":[{"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/comments?post=79955"}],"version-history":[{"count":0,"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/posts\/79955\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/media\/79957"}],"wp:attachment":[{"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/media?parent=79955"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/categories?post=79955"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/tags?post=79955"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}