{"id":8691,"date":"2023-04-22T01:03:08","date_gmt":"2023-04-21T17:03:08","guid":{"rendered":"https:\/\/wp-productionenv-bjg9h2g2bgg5b8aa.southeastasia-01.azurewebsites.net\/news\/stratedge-to-showcase-its-latest-high-temperature-packaging-technology-at-upcoming-events\/"},"modified":"2023-04-22T01:03:08","modified_gmt":"2023-04-21T17:03:08","slug":"stratedge-to-showcase-its-latest-high-temperature-packaging-technology-at-upcoming-events","status":"publish","type":"post","link":"https:\/\/starpath.global\/news\/stratedge-to-showcase-its-latest-high-temperature-packaging-technology-at-upcoming-events\/","title":{"rendered":"StratEdge to Showcase its Latest High-Temperature Packaging Technology at Upcoming Events"},"content":{"rendered":"<p style=\"text-align: center;\" itemprop=\"image\" itemscope=\"\" itemtype=\"https:\/\/schema.org\/ImageObject\"><img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/cdn.satnow.com\/news\/stratedge_C_638174773036305590.png\" width=\"712\" height=\"377\" alt=\"StratEdge to Showcase its Latest High-Temperature Packaging Technology at Upcoming Events\" class=\"imageload removeImageattr\" data-original=\"https:\/\/cdn.satnow.com\/news\/stratedge_C_638174773036305590.png\" style=\"\"><meta itemprop=\"url\" content=\"https:\/\/cdn.satnow.com\/news\/stratedge_C_638174773036305590.png\"><meta itemprop=\"width\" content=\"712\"><meta itemprop=\"height\" content=\"377\"><\/p>\n<p>StratEdge Corporation, one of the leaders in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter-wave devices, is set to showcase its latest packaging technology for high-temperature applications at several industry conferences in April and May. The events will take place in New Mexico, California, and Florida, and will highlight StratEdge&#8217;s commitment to producing packages that can survive extreme conditions in space and beyond.<\/p>\n<p>At the IMAPS International Conference and Exhibition on High-Temperature Electronics (HiTEC), with an exhibition that runs from April 18-19 in Albuquerque, NM, StratEdge will be exhibiting at Booth 4. The company will showcase its expertise in packaging for high-temperature applications, including Si, GaAs, and GaN devices.<\/p>\n<p>StratEdge will also be exhibiting at the Components for Military &amp; Space Electronics Conference &amp; Exhibition\u2014CMSE, which will be held in Los Angeles, CA from April 26-27. The company will be located at Booth B19, and Casey Krawiec, vice president of global sales, will be presenting &#8220;Package and Die Attach Comparisons for High Power GaN Devices.&#8221; The presentation will focus on thermal simulations conducted by StratEdge to compare the thermal dissipative properties of different packaging materials for GaN devices.<\/p>\n<p>In addition, StratEdge will be showcasing power amplifier packages at Space Tech Expo, which takes place from May 2-5 in Long Beach, CA. These packages play a crucial role in transmitting signals from commercial and government satellites and other long-range communications equipment. StratEdge will be located at Booth 5027.<\/p>\n<p>Finally, StratEdge will be exhibiting at CS Mantech, which runs from May 15-17 in Orlando, FL. The company will be located at Booth 211 and will highlight its latest high-reliability package families.<\/p>\n<p>&#8220;StratEdge packages have been popular for their heat dissipating properties and high reliability for over 20 years,&#8221; said Tim Going, president of StratEdge. &#8220;With a continued emphasis on increasing power output and pushing the capabilities of chips to deliver ever-higher frequencies, these packages are more critical than ever. Attending these shows enables us to work with engineers to build packages that enable proper functioning of their chips.&#8221;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>StratEdge Corporation, one of the leaders in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter-wave devices, is set to showcase its latest packaging technology for high-temperature applications at several industry conferences in April and May. The events will take place in New Mexico, California, and Florida, and [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"inline_featured_image":false,"footnotes":"","_links_to":"","_links_to_target":""},"categories":[2],"tags":[26,20],"class_list":["post-8691","post","type-post","status-publish","format-standard","hentry","category-news","tag-ground","tag-satellite"],"acf":[],"_links":{"self":[{"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/posts\/8691"}],"collection":[{"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/comments?post=8691"}],"version-history":[{"count":0,"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/posts\/8691\/revisions"}],"wp:attachment":[{"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/media?parent=8691"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/categories?post=8691"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/starpath.global\/blog\/wp-json\/wp\/v2\/tags?post=8691"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}