Teledyne HiRel Semiconductors, a leader in ruggedized semiconductors for mission-critical environments, announced the release of the TDD416Y12NEPBM01, a compact DDR4 memory module, screened and qualified as an Enhanced Product (EP) and rated for operation from –40°C to +105°C.
The TDD416Y12NEPBM01 is a compact, solder-down DDR4-3200 memory solution that delivers high bandwidth in a dramatically reduced footprint – smaller than a postage stamp. Packaged in a 216-ball BGA measuring just 22mm x 22mm, it is engineered for systems where board space is limited and performance is critical.
Its streamlined design integrates memory, termination, and passives into a single unified 22mm2 module, effectively replacing multiple discrete components and simplifying layout complexity. Unlike monolithic ECC memory modules, the TDD416Y12NEPBM01 supports error correction through an optional companion ECC. This architecture offers key technical advantages such as thermal isolation, design flexibility, and cost savings.
