SatixFy Communications, one of the leaders in next-generation satellite communication systems based on in-house-developed chipsets, announced the advancement of its Prime 2.0 Digital Beamformer (DBF) chip (the “Prime 2.0 Chip”) and the Sx4000 Digital Payload On-Board-Processing Chip (the “Sx4000 Chip”) for Digital Satellite Payload, to the stage of advanced customer sampling.
Both the Prime 2.0 Chip and the Sx4000 Chip are presently sampling to customers, including low earth orbit (LEO) and geostationary orbit (GEO) satellite manufacturers. The Sx4000 Chip is currently undergoing final irradiation tests and is expected to achieve flight-ready status during the second half of 2024.
Nir Barkan, Acting Chief Executive Officer of SatixFy, commented, “We are very pleased with the advancements that we continue to make, meeting our ongoing milestones. We see our recent progress with both the Sx4000 Chip and the Prime 2.0 Chip as a significant step forward in our journey in becoming the key enabler of next-generation satellite communication systems. We believe these chips will be seen by the market as essential building blocks for developing satellite payloads. We are confident in the direction and long-term potential of our technology and look forward to the commercialization of our solutions and ultimately reaping the rewards of our investments.”
SatixFy will showcase its space chips at the upcoming Satellite Show, scheduled to take place from March 19-21, 2024, in Washington D.C.
Click here to learn about SatixFy’s Satellite Payload Solutions.
